Senior Process Engineer - Packaging

We are looking for a Senior Process Engineer - Packaging to develop and optimize microelectronics packaging processes and techniques to package ion traps for use in quantum computers. As a Senior Process Engineer, you'll be part of a cross-functional team whose mission is to lead IonQ on its journey to build the world's best quantum computers to solve the world's most complex problems.

Responsibilities:

• Take ownership of and improve our existing packaging processes with respect to yield, throughput, and capability.
• Research and develop new packaging processes to meet next generation product requirements, from conception, to equipment procurement, to IQ-OQ-PQ.
• Perform sustaining engineering activities to support the entire packaging process.
• Execute new product introduction activities, including hands-on prototype builds from component procurement to characterization.
• Lead failure analysis efforts to identify root cause and corrective actions for packaging and device failures.
• Develop a deep understanding of system operation requirements and cause-effect relationships between package/device construction and system performance.

You'd be a good fit with:

• 6+ years of professional experience or an equivalent combination of education and experience
• 5+ years of hands-on experience in a fast-paced, high-tech manufacturing environment in the semiconductor industry.
• Experience in micro-electronics and/or opto-electronics assembly, using, maintaining, and troubleshooting equipment such as:
• Wirebonding machines
• Die-attach/pick-and-place machines
• Solder reflow ovens
• Hand soldering equipment
• Epoxy dispense (automated or manual) equipment
• Metrology Equipment (CMM, Profilometer, etc.)
• Electrical testing equipment (VNA, DMM, Oscilloscope, etc.)
• Plasma Cleaners
• Experience working in a cleanroom environment (e.g. ISO Class 6 cleanroom with full cleanroom gowning).
• Ability to work independently and in a team setting, as well as cross functionally with various organizations.
• Experience with using CAD software to design fixturing and tooling for packaging processes.
• Ability to perform moderate strenuous physical and repetitious work.
• Excellent verbal and written communication skills.
• Strong computer skills with proficiency in Google Software Suite (e.g. Sheets, Slides) and/or MS Office.

You'd be a great fit with:

• 2+ years of experience packaging and testing complex opto-electrical devices (laser diodes, optical RF generators, fiber optics communication microelectronics, etc.).
• Knowledge of Ultra High Vacuum (UHV) / Extreme High Vacuum (XHV) packaging techniques, material requirements, and process requirements.
• Experience with electron imaging and analytical chemistry techniques used in microelectronics failure analysis.
• Experience developing electrical test methods for RF and DC electronics, at both device and package levels.

Location: This role is based onsite at our headquarters in College Park, MD, with the option to work remotely one day per week depending on project needs.

Travel: Minimal to none.

Job ID: 1083

The approximate base salary range for this position is $123,191 - $161,289. The total compensation package includes base, bonus, and equity.