Assembly and Packaging Development Engineer

We are seeking an experienced Package Development Engineer to lead the design and development of advanced IC packages for power, analog, mixed-signal, high-speed RF, and digital applications. This role is pivotal in ensuring packaging solutions meet stringent requirements for performance, reliability, cost, and manufacturability.

Responsibilities

• Lead the design and development of packaging solutions for new and existing ICs, ensuring compliance with power, thermal, mechanical, signal integrity, testability, and reliability requirements.

• Evaluate packaging technologies and suppliers globally to select optimal solutions based on technical performance, cost, and risk.

• Drive internal technical reviews, roadmap alignment, supplier evaluations, audits, and BOM selection.

• Align packaging strategies with internal product roadmaps, resource and cost constraints, supplier capabilities, and customer requirements.

• Collaborate with Design, Product, Foundry, and Test teams to define packaging requirements and guide silicon and hardware design using DFM and simulation results.

• Advise on silicon metallization schemes, signal/power routing, bump/ball layouts, and netlist optimization to ensure efficient package integration.

• Define and manage package qualification and reliability plans; troubleshoot and resolve reliability issues from field or product qualification failures.

• Support root cause analysis (e.g., 8D) and corrective actions (CAR) for supplier-related quality issues and process excursions.

• Provide input to PFMEAs and help identify critical-to-quality characteristics to support a zero-defect manufacturing strategy.

• Maintain documentation, specifications, and procedures related to package design and process control.

• Assess and mitigate the impact of supplier PCNs and drive cost reduction and yield improvement initiatives.

• Support development of alternate sources and help negotiate with packaging suppliers.

Key Qualifications

• 10+ years of experience in IC package design for high-power and high-speed RF/digital applications.

• Proven experience in multi-chip and multi-layer package design, including aQFN, WLCSP, WLBGA, FCCSP, FCBGA, MISBGA, Embedded Die, MCM, and SiP.

• In-depth knowledge of flip-chip substrate and wirebond lead frame design, including RDL, bumping, copper pillars, and signal/power integrity considerations.

• Solid understanding of package failure mechanisms and reliability models.

• Hands-on experience with mechanical, electrical, and thermal simulation tools (e.g., Flotherm, Icepak).

• Familiarity with backend silicon layout tools such as Cadence, AutoCAD, APD, or SiP.

• Exposure to assembly equipment, substrate and lead-frame processes, and package process integration.

• Strong analytical and root-cause problem-solving skills.

• Experience collaborating with and negotiating technical and commercial terms with suppliers.