Intel Government Technologies (IGT) is a wholly owned subsidiary of Intel Corporation, dedicated to managing Intel's business with governments worldwide. Our mission is to leverage Intel's cutting-edge technology and expertise to address the unique needs and challenges government agencies face. We collaborate across Intel's diverse teams to develop and execute innovative programs that support government operations and enhance public service delivery.
Primary duties and responsibilities:
- Initiates the design, development, execution, and implementation of scientific research projects to fuel growth in computing, communication, memory, networking, intellectual property, and new business opportunities.
- Applies scientific research principles and concepts to potential inventions and products in hardware engineering, developing the vision and value proposition, aligning strategy, and driving fast paced research and development to improve efficiency and meet timelines.
- Utilizes advanced knowledge of computing, memory, IO, and/or network subsystems and hardware/software codesign principles to drive requirements and specifications for both hardware and software at the IP, SoC, platform, and system levels.
- Conducts simulation, prototyping, and workload analysis to achieve performance/watt/dollar optimized system implementations.
- Research technological trends, enables partnerships and collaboration among industry, academia, standards bodies, product, and other technical groups to address important technology and customer issues, and finds innovative solutions to difficult problems for midterm or long-term time frames.
- Influences external research, disseminates results, and raises the profile of conducted research through scientific publications, patents, talks, and Intel internal or external outreach efforts.
- Performs research to define boundaries and creates proof of concepts or prototypes new ideas including chips and competitive analysis versus industry trends.
- Collaborates with customers to explore potential customer requirements in mid and long term, works with engineering design teams to determine product requirements and the feasibility of new technology adoption and integration.
- Recommends features and influences future Intel product roadmap.
The successful candidate should exhibit the following behavioral traits:
Multiple examples of mentoring and coaching junior employees.
Excellently demonstrated written and verbal communication skills.
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Qualifications:You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your degree, research and or relevant previous job and or internship experiences.
Minimum Qualifications:
- US Citizenship required.
- Ability to obtain a U.S. Government Security Clearance.
- Bachelor's degree in electrical engineering or computer engineering field with strong technical expertise in circuits, hardware architecture, digital signal processing, radio circuits, or 2.5D/3D heterogeneous integration, including chiplet based architectures and die-to-die I/Os.
- 7+ years of experience working in the above domain expertise technical individual contributor role.
Preferred Qualifications:
- 10+ years of experience working in developing HW/SW/FW IPs for 2.5D/3D chiplets in a technical individual contributor role.
- Diverse 2.5D/3D chiplet and radio/radar engineering expertise across multiple processing domains (e.g., FPGA, high-performance computing, edge computing and sensing)
- Extensive engineering expertise with Intel silicon, hardware and software products.
- Proven record of executing on prototypes or products for Government customers.
- Ability to understand the broad portfolio of Intel's products, services, and technical capabilities and how they could be applied to create differentiated product-driven value for Government customers.
- Excellently demonstrated written and verbal communications skills.
- Proven success in implementing 2.5D/3D die-to-die I/Os, chiplet centric HW/SW/FW IPs.
- Multiple successfully completed projects demonstrating technical knowledge of the above domains
Benefits:
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here:
Annual Salary Range for jobs which could be performed in the US:
$177,200.00-$250,160.00S al ary range dependent on a number of factors including location and experience.
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.